AMS Asia Pacific Supplement August 2017 – “Down To Earth, Validation Tests of PROFIL’s Earthing Studs”
New PEM® SMTSS™ ReelFast® SNAP-TOP® Standoff Fasteners Hold Printed Circuit Boards Securely Without Mating Screws or Other Hardware
New PEM® SMTSSS™ ReelFast® SNAP-TOP® standoff fasteners from PennEngineering® hold printed circuit boards securely in assemblies without requiring mating screws or other loose threaded hardware to complete attachment. These unthreaded standoffs promote streamlined production by easily installing in boards in the same manner and at the same time as other surface mount components prior to the automated reflow solder process. They ultimately enable precise and reliable mounting and spacing of boards using less hardware and fewer operations.
Rocky Pinheiro Joins PennEngineering® as Global Vice President of Quality
DANBORO, PA, USA, July 20, 2017 – Rocky Pinheiro has joined PennEngineering® as Global Vice President of Quality, it was announced today by the Company. Pinheiro will be responsible for driving enterprise-wide quality systems improvement, excellence, and evolution and will function as a corporate source matter expert with PennEngineering’s established quality teams in each plant and selling organization.
PennEngineering® Acquires Whitesell® Formed Components and Whitesell® Canada
DANBORO, PA, June 28, 2017 – PennEngineering® is pleased to announce the acquisition of Whitesell® Formed Components, with operations in Waterford, Romulus and Novi, MI, and Whitesell® Canada in Vaughan, Ontario, Canada.
PEM® VariMount® Fastening System Enables Use of Self-Clinching Fasteners for Attachment Applications in Composites, Plastics, and Other Rigid Materials
The PEM® VariMount® fastening system from PennEngineering® enables the use of PEM® self-clinching fasteners for attachment applications in composites, plastics, metal, and any rigid material or panel. The system integrates a self-clinching nut, stud, or standoff pre-installed permanently into a steel or stainless steel base plate. The base plate with multiple radial holes effectively becomes a mounting platform, which can be bonded or mechanically attached to virtually any rigid material. Once mounted, the pre-installed PEM self-clinching fastener ultimately is positioned where designed to accept mating hardware.
PennEngineering® Announces Expanded Lead-Free Initiative Promoting Environmental, Sustainability, and Marketplace Objectives
PennEngineering®, a global pioneer for 75 years in the development and manufacture of precision fasteners and systems, announces that it now uses lead-free material for the manufacture of its entire cataloged product line of steel fasteners. This strategic industry leadership action is being implemented to eliminate any potential lead-related environmental issues, underscore a longstanding role as environmentally friendly manufacturer, promote overall sustainability objectives, and provide the marketplace with the capability to plan and develop completely lead-free products and components.
New Atlas® Process Monitoring Unit Provides Instant Feedback on Installation of Blind Threaded Inserts
The new Atlas® Process Monitoring unit introduces a cost-effective capability to monitor the operation of standard Atlas tools while installing blind threaded inserts and provide instant feedback and defect detection in line with quality and process requirements.
PEM® TY-D® Self-Clinching Cable Tie-Mounts and Hooks Securely Attach Cables and Wires to Electronic Chassis or Enclosures
PEM® TY-D® self-clinching cable tie-mounts and hooks from PennEngineering® create secure metal attachment points for mounting wires and cables to electronic chassis or enclosures. The hardware installs quickly and reliably in thin steel or aluminum panels, eliminates any need for screws or adhesives, and can be positioned permanently at specified locations and angles to promote optimized layouts. On the reverse side of hardware installation, panels remain smooth without protrusions to enhance the appearance of an assembly, maintain clearance requirements, and protect against potential EMI/RFI interference or contamination of electronics by dust or dirt.